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  This study presents a numerical model to analyze
  dynamic thermal behavior of a hot chuck designed for flip-chip bonders.
  A series of numerical tests illustrate the usefulness of the numerical
  model in design analysis. Finite element model and the basic
  experimental method have been developed to help the design of the transverse ultrasonic horn for flip-chip bonding.
  Darveaux, R., Islam, M. N., Singh, N., and Suhling, J.
  
  C., 2004, "Model for BGA and CSP Reliability in Automotive Underhood Application," IEEE Transaction on Components and Packaging Technologies, Vol.
  S. W. Lee, D. J. Choi, C. K. Song, and M. G. Chun, "LED Inspection System of Post-Molding Process using Image Processing", Journal of Korean Institute of Information Technology, Vol.
  J. Y. Choi, M. Y. Kim, S. K. Lim, and T. S.
  Oh, "Flip Chip Process for RF Packages Using Joint Structures of Cu and Sn",
  J. Microelectron. A. Hamdan, A. McLanahan, R.
  
  Richards, and C. Richards, "Characterization of a liquid-metal microdroplet thermal interface material", Exp.
  A. J. McNamara, Y. Joshi, and Z. M. Zhang, "Characterization of nanostructured thermal interface materials: A review", Int.
  In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed
  for the utilization of low thermal resistance substrate films,
  such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate).